Simulation of copper nanoindentation using LAMMPS - atomic to micro-scale
DOI:
https://doi.org/10.61603/ceas.v2i1.32Keywords:
nanoindentation, molecular dynamics simulation, copper mechanical properties, LAMMPS, nanoscale material behavior, atomic-scale interactions, computational material scienceAbstract
This study explores the mechanical properties of copper at the nanoscale through molecular dynamics simulations of nanoindentation using LAMMPS. Focusing on atomic-scale interactions, the research investigates the relationship between indentation depth and pressure, considering factors like indenter shape and application rate. The simulations reveal complex material behaviors diverging from classical Hertzian contact theory, highlighting the intricacies of nano-scale mechanical responses. The study contributes significantly to the understanding of copper’s mechanical properties and the application of computational simulation in material science.
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Copyright (c) 2024 Minyu Tang, Jiayu Huang, Dan Luo, Jinyi Zhang, Zhuofan Li, Yixiang Huang
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