Simulation of copper nanoindentation using LAMMPS - atomic to micro-scale

Authors

  • Minyu Tang School of Applied Physics, Chongqing University
  • Jiayu Huang School of Mechanical Engineering, Beijing Institute of Technology
  • Dan Luo School of Material Science and Engineering, Northeastern University
  • Jinyi Zhang School of Material Science and Engineering, Nanjing University of Posts and Telecommunications
  • Zhuofan Li School of Physics, Jilin University
  • Yixiang Huang School of Material Science and Engineering, Nanjing Forestry University

DOI:

https://doi.org/10.61603/ceas.v2i1.32

Keywords:

nanoindentation, molecular dynamics simulation, copper mechanical properties, LAMMPS, nanoscale material behavior, atomic-scale interactions, computational material science

Abstract

This study explores the mechanical properties of copper at the nanoscale through molecular dynamics simulations of nanoindentation using LAMMPS. Focusing on atomic-scale interactions, the research investigates the relationship between indentation depth and pressure, considering factors like indenter shape and application rate. The simulations reveal complex material behaviors diverging from classical Hertzian contact theory, highlighting the intricacies of nano-scale mechanical responses. The study contributes significantly to the understanding of copper’s mechanical properties and the application of computational simulation in material science.

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Published

2024-02-07

Issue

Vol. 2 No. 1 (2024)

Section

Articles

License

Copyright (c) 2024 Minyu Tang, Jiayu Huang, Dan Luo, Jinyi Zhang, Zhuofan Li, Yixiang Huang

Creative Commons License

This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International License.

How to Cite

Simulation of copper nanoindentation using LAMMPS - atomic to micro-scale. (2024). Cambridge Explorations in Arts and Sciences, 2(1). https://doi.org/10.61603/ceas.v2i1.32